| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic module enhanced with interconnects and components, by collectively forming electronic components containing an electronic module, on an almost flat surface of the electronic module which has a plurality of stacked integrated circuit chips and the almost flat surface. SOLUTION: Chips 11 are stacked and an electronic module is formed, and transfer metal 17 is followed. After the chips are laminated, a flat surface is formed by etching the side surface of the module. Positions of interconnects are specified, a mask is formed, etching is performed, a notch is formed, and insulator and further conductor are buried in the notch, thereby forming interconnects 19a, 19b which are electrically insulated from a board. The surfaces 23, 24 of the module where the interconnects intersect with each other are polished, and the surfaces are flattened. The side surfaces of the module are metallized, and the chips are interconnected.
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