METHOD FOR FILLING HOLE BY HIGH PRESSURE REFLOW

摘要

PURPOSE: To fill a contact hole with a part of metal film by high pressure reflow by making the contact hole such that the contact resistance is not increased. CONSTITUTION: A plurality of contact holes 14 are made through an insulation film 13 for one electrical connection. Minimum diameter of each contact hole 14 (14a-14d) is set smaller than the thickness of a metal film 16 deposited on the insulation film 13. The metal film 16 is then deposited on the insulation film 13 while leaving a space in each contact hole 14a-14d and then pressure is applied to the surface of the metal film 16 so that a part of the metal film 16 is pushed into each contact hole 14a-14d thus filling each contact hole 14a-14d with a part of the metal film 16. Minimum diameter of the plurality of contact holes 14a-14d is preferably set at 0.6μm or less.