发明名称 PACKAGING STRUCTURE FOR MICROWAVE CIRCUIT
摘要 PURPOSE: To join device blocks with each other or a mother board with the device block without generating a gap as far as possible. CONSTITUTION: A slender recessed part 14 extending from the side terminal of the mother board 10 is formed at a prescribed position on the upper surface of the mother board. The depth of the recessed part 14 is formed nearly equal to the thickness of both device blocks 20, 30, and the width of the recessed part 14 nearly equal to that of the device blocks 20, 30, and the length of the recessed part 14 nearly equal to the total length of both device blocks 20, 30. The square device block 20 is fitted in the mother board recessed part 14, and it is tightened with a screw by pressing on the terminal of the recessed part 14. Thence, the rectangular device block 30 is fitted in the mother board recessed part 14, and it is tightened with the screw by pressing on the side of the device block 20.
申请公布号 JPH08204409(A) 申请公布日期 1996.08.09
申请号 JP19950027691 申请日期 1995.01.25
申请人 FUJI ELELCTROCHEM CO LTD 发明人 TAMURA TAKASHI;IKEDA YUTAKA
分类号 H05K1/16;H01P1/00;H01P1/04;H01P3/08;H05K7/02;H05K7/14 主分类号 H05K1/16
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