System zur Wärmeabführung für ein elektronisches Bauelement und ein geschlossenes Gehäuse in einem solchen System

摘要

The dissipation system of the invention is of the type comprising a seated metal enclosure (21), the internal volume of which includes a fluid (22), the component (11) being fixed on the outer wall of this enclosure (21) and linked to a thermal dissipator (12) via this enclosure (21), and is characterised in that the phase-change temperature of the fluid (22) at atmospheric pressure is lower than a given maximum ambient temperature, and in that the enclosure (21) also includes a volume of gas (23) different from the fluid (22), in such a way that a variation in the ambient temperature causes a pressure variation within the enclosure (21) which alters the phase-change temperature of the fluid (22).