CHIP HOUSING AND PROCESS FOR PRODUCING IT

摘要

A housing to accept at least one electronic component, e.g. a chip (1) or the like, and a process for producing such a housing with a cover (12) and a counter-cover (13) accepting the electronic component between them, in which there are conductive tracks (15, 16 or 24, 25) on the inner surfaces of the cover (12) and the counter-cover (13) in such a way that the tracks (15, 16) on the cover (12) connect terminal areas (21, 22) of the component (11) to the tracks (24, 25) on the counter-cover (13) and the tracks (24, 25) on the counter-cover (13) open into external terminals (32, 33) of the housing (10). The cover (12) and/or the counter-cover (13) has/have a flexible substrate layer (14) and are interconnected in the cover connecting regions (73) which surrounds the component (11).