An automatic wafer lapping apparatus in which a pair of turntable stages are provided which each have a vertical central shaft and a pin on which the wafer carriers are spitted and piled up; furthermore, the teeth of the sun gear and the internal gear of the lapping assembly are bevelled at their upper portions in a manner such that the upper end of each tooth is tapered and converge into a linear ridge so as to facilitate automatic and prompt meshing of the carriers inbetween them. <IMAGE>
