Method of bonding a contact-type thin film magnetic head element to a supporting beam

摘要

A method of bonding a magnetic head element to a beam for supporting the element during a process of producing the magnetic head is disclosed. A connecting pad (10) of the magnetic head element (5) is put into contact with a signal conductor (9) of the supporting beam (4). Then, a vibration energy of an ultrasonic wave is applied to the contact portion so that the surfaces of the components in the contact portion are caused to diffuse into each other. As a result, a state in which the connecting pad (10) is mechanically coupled and electrically connected to the signal conductor is obtained.