Electrochemical measurements for in-situ monitoring of semiconductor wafer cleaning processes

摘要

The method for monitoring the physical or chemical action of a chemical solution on a surface of a semiconductor material in contact with said chemical solution comprising: a. measuring the potential difference between a working electrode and a reference electrode, said reference electrode being in contact with said chemical solution, thereby obtaining measurement data, b. obtaining condition data which indicate the physical and/or chemical condition of said semiconductor material over a predetermined period of time; and c. correlating said condition data to said measurement data in order to monitor the physical or chemical action of said chemical solution on said surface.