SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: A semiconductor chip package is provided, which forms an yield film of an electromagnetic wave on a surface of a molder for yielding a electromagnetic wave occurred from a semiconductor chip. CONSTITUTION: The semiconductor chip package comprises: a semiconductor chip (32) which bonding pads (34) are formed on a certain surface; leads (36) to be electrically coupled to bonding pads (34) by a conductive means; a molder (44) for molding the semiconductor chip (32) and the circumference of the semiconductor chip (32) for outputting outleads (42) among leads (36); and an electromagnetic wave yield portion (46) to be formed on a surface of the molder (44) at a state grounded to a certain ground lead among outleads (42) for covering the surface of the molder (44). Since the yield film of an electromagnetic wave can to easily formed using conductive materials, the producing rate of the product can to be improved.