发明名称 |
Fault tolerant interconnect topology using multiple rings |
摘要 |
An interconnect topology providing enhanced fault tolerance to a multi-component data processing system. The topology utilizes a plurality of rings for interconnecting multiple system components, or cards, at least two of which are indirectly connected so that communication therebetween is through a third component. Each of the system components is coupled to a set of at least two different rings and includes interface circuits for routing data and a bridge for permitting data to be transferred between the at least two rings.
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申请公布号 |
US5544330(A) |
申请公布日期 |
1996.08.06 |
申请号 |
US19940275005 |
申请日期 |
1994.07.13 |
申请人 |
EMC CORPORATION |
发明人 |
BITHER, DAVID S.;LOEWY, CHARLES S. F.;WILSON, PAUL C. |
分类号 |
G06F11/00;G06F11/20;(IPC1-7):G06F13/00 |
主分类号 |
G06F11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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