发明名称 Fault tolerant interconnect topology using multiple rings
摘要 An interconnect topology providing enhanced fault tolerance to a multi-component data processing system. The topology utilizes a plurality of rings for interconnecting multiple system components, or cards, at least two of which are indirectly connected so that communication therebetween is through a third component. Each of the system components is coupled to a set of at least two different rings and includes interface circuits for routing data and a bridge for permitting data to be transferred between the at least two rings.
申请公布号 US5544330(A) 申请公布日期 1996.08.06
申请号 US19940275005 申请日期 1994.07.13
申请人 EMC CORPORATION 发明人 BITHER, DAVID S.;LOEWY, CHARLES S. F.;WILSON, PAUL C.
分类号 G06F11/00;G06F11/20;(IPC1-7):G06F13/00 主分类号 G06F11/00
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