STRUCTURE HAVING SOLDER LAYER AND CONDUCTIVE COMPOSITION USED TO MAKE SAME

摘要

PURPOSE: To obtain a structure having a solder layer on the surface layer of a conductive composition and improved in wettability between the solder layer and the conductive composition and deflection strength by using a specified composition as the conductive composition. CONSTITUTION: This structure is composed of a conductive composition mainly consisting of desirably 3-40wt.% binder component 2 comprising a resol phenolic resin having dimethylene ether bonds and a linear polymer resin (e.g. polyamide resin) and desirably 60-97wt.% metallic particle component 1 having a mean particle diameter of 0.1-50μm and a solder layer 4 which comes in direct contact with the metallic particle component 1. It is desirable that the metallic particle used is one in which the core is made of an Ni component and the surface of the core is coated with at least one noble metal selected from among Au, Ag, Pd and Pt.