Process for adhesively attaching a semiconductor device to an electrode plate

摘要

In a semiconductor device, a semiconductor element is stored in a casing while being held by external electrodes through first and second electrodes. The outer peripheral edge of the first electrode plate is projected outwardly beyond that of the semiconductor element and a ring-shaped groove is provided in the first surface of the first electrode plate along the outer peripheral edge of the semiconductor element such that a line, which is projected along the outer peripheral edge of the semiconductor element on the first surface of the first electrode plate, is located on the ring-shaped groove portion. The adhesive holding member is applied in the groove and the outer peripheral portion of the semiconductor element. Thus, the semiconductor element is fixed to the first electrode plate and is protected by the adhesive holding member which covers its end portion.