| 摘要 |
A power semiconductor device package of the invention is used for a power conversion equipment. The package is formed of a casing containing a power chip therein, external main circuit terminals for direct-current input and alternating-current output, and pin terminals for connection to an external control circuit. The main circuit terminals and pin terminals are arranged in two rows on the upper surface of the casing. In the invention, at least one of the connecting terminals for a snubber circuit and the support terminals is situated on the upper surface of the casing. The connecting terminals are connected inside the casing to the main circuit terminals for the direct-current input to have the same electric potential. The supporting terminals are arranged adjacent to the pin terminals so that a printed circuit board for the external control circuit can be securely fixed to the casing.
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