| 摘要 |
<p>PURPOSE: To obtain a conductive resin compsn. for IC packaging which hardly stains an IC, etc., by compounding a specific thermoplastic resin, carbon black, and a hydrogenated styrene-diene block copolymer resin in a specified wt. ratio. CONSTITUTION: This compsn. comprises 100 pts.wt. at least one thermoplastic resin selected from among a polyphenylene ether resin, a polystyrene resin, and an ABS resin, 5-50 pts.wt. carbon black, and a hydrogenated styrene-diene block copolymer resin in an amt. of 1-30wt.% of the sum of the thermoplastic resin and the carbon black and has a surface resistivity of 10<2> -10<10>Ω.</p> |
