| 摘要 |
PURPOSE: To make it possible to mold a resin free from air voids by using an ordinarily used compression resin or powder resin in a resin molding device. CONSTITUTION: In a resin molding device which clamps an article to be molded 20 between the forces 10a, 10b of a molding die and molds a resin by supplying the resin to a pot 12, a wrapping resin 30 consisting of a pulverized resin molded by compression into a compressed resin or the pulverized resin as such which is wrapped airtightly by a wrapping film 31, is used. In addition, a recessed air trap part 28 for trapping the air separated from the resin when the wrapping resin 30 is fused, is provided on the opposite die face of the top force 10a to the pot 12 installed on the bottom force 10b of the molding die. |
