| 摘要 |
A multilayered printed wiring board (500) comprises (a) a first board comprising an inner layer (20) of PTFE having a predetermined dielectric constant, between a metal outer layer (10) having high frequency circuitry and a second metal outer layer (30); (b) a second board comprising an inner layer (60) of a dielectric material of predetermined thickness, not PTFE, between two outer metal layers (50, 60); and, in between, (c) a third board (40) of a dielectric material, not PTFE, of equiv. thickness to the inner layer (60). The strips of (b) form signal lines and transmission lines and are bonded to the first side of the inner layer of (b). |
