HEATING APPARATUS FOR MANUFATURING PROCESS OF SEMICONDUCTOR

摘要

PURPOSE: A heating apparatus is provided to reduce the time to raise the temperature of a chamber and to achieve high thermal efficiency on the manufacturing process of a semiconductor. CONSTITUTION: A power supply unit(14) applies an AC current to a coil(12) which locates at a wall of the chamber. With passing time, a magnetic filed rises around the coil(12) and induces an inductive current(34). The inductive current is a vortex current(34) which flows in a skin depth of the wal(32)l of the chamber determined by a conductivity of the wall(32) of the chamber and a frequency of the AC current flowing the coil. When the vortex current(34) is induced on the wall(32) of the chamber. heat is generated by the vortex current(34) and internal resistance.