发明名称 METHOD FOR COUPLING PARTS OF PRINTED CIRCUIT BOARD USING CONDUCTIVE BOARD
摘要 PURPOSE: A method for coupling parts of printed circuit board using conductive board is provided to assemble a printed circuit board cheaply and safely. CONSTITUTION: A printed circuit board(10) is coated by a solder resist portion(30) on a portion except for a land portion(20) in which a hole(15) engaged with a part is formed. A same circuit pattern as the printed circuit board(10) is printed and a land hole(45) which has a size corresponding to the land portion(20) is penetrated. A part(35) is printed on one side surface. A nonconductive thin plate(40) which has a predetermined thickness has a bonding layer(42). The bonding layer(42) of the thin plate(40) is bonded on the upper surface of the solder resist portion(30) of the printed circuit board(10).
申请公布号 KR20010008282(A) 申请公布日期 2001.02.05
申请号 KR20000069148 申请日期 2000.11.21
申请人 OH, WOO SUK 发明人 OH, WOO SUK
分类号 H05K1/18;(IPC1-7):H05K1/18 主分类号 H05K1/18
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