Vorrichtung und Verfahren zum Herstellen von optoelektronischen Bauelementen

摘要

The appts. for the prodn. of opto-electronic components has a moulding bar (2) with cavities (6) with at least two supports (3) at the upper side. The supports (3) have an upper locking point (4) and a central depth limit (5) or a lateral strap (15). A grid strip (1) with a transport strap (13) has paired connection legs (14a,14b) bonded at their upper ends to the strap (13). One leg (14a) of each pair has a reflector (10) with a semiconductor body with connecting members (12) to link the leg pairs (14a,14b) together. The transport strap (13) is suspended at the locking points (4) of the supports (3) so that the semiconductor bodies are still clear of the cavities (6). The connecting members (12) rest on the depth limits (5) at the supports (3) when the semiconductor bodies of the grid strip (1) are inserted into the cavities (6).