| 摘要 |
The invention relates to the removal of particles from the surface of an article, for example, a semiconductor wafer (10) or a paper product, through the inducement of cavitation on the surface of the article at the location of an adherent particle. Cavitation is induced by focusing two acoustic fields on the surface of the article. The two acoustic fields include a cavitation field (30) having relatively low frequency focused on the surface of the article from a direction substantially perpendicular to the surface of the article and a coaxing field (20) of relatively high frequency focused on the surface of the article from a direction between about 0-25 degrees from the surface of the article.
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