| 摘要 |
A plurality of slits (11i/11n, 11j/11o, 11k/11p, 11m/11q) are formed in a tub (11a) of a lead-frame (11) for mounting a semiconductor chip (10), and are arranged in such a manner as to nearly equalize the length of peripheral sub-areas (11ha/11hh/11ha) of the tub uncovered with the semiconductor chip, thereby effectively absorbing a shrinkage and an elongation due to a difference in thermal expansion coefficient among the tub (11a), the semiconductor chip (10) and a plastic package hermetically sealing the semiconductor chip. <IMAGE> |
