EDGE CONNECTABLE METAL PACKAGE

摘要

There is provided an edge connectable electronic package (90). The package (90) has a metallic base (92) at least partially coated with a dielectric layer. An interconnection means (96) taking the form of either a leadframe or a circuit trace is electrically interconnected to an encased semiconductor device (94). The opposing end of the interconnection means (96) extends to the package perimeter for interconnection to a socket or brazing to external leads.