| 摘要 |
PROBLEM TO BE SOLVED: To provide an Sn-Pb-base solder ally which is excellent not only in thermal fatigue resistance but in solderability and surface gloss after soldering as well. SOLUTION: This alloy for solder balls consists of 2 to 65 mass% Sn, 0.1 to 1 mass% Sb, 0.01 to 0.1 mass% Cu, 0.01 to <0.1 mass% Bi and the balance Pb.
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