发明名称 |
Guard ring for integrated circuit package |
摘要 |
There is provided a leadframe having a plurality of coplanar electrically conductive leads. At least one metallic guard is bonded to the leads with a dielectric layer disposed between the metallic guard and the leads. The metallic guard has good adhesion to a polymer molding resin such that when the leadframe structure is encased in a molding resin, delamination is minimized. By restricting delamination, the ingress of water and water soluble contaminants to an integrated circuit device is inhibited. |
申请公布号 |
AU4611296(A) |
申请公布日期 |
1996.07.31 |
申请号 |
AU19960046112 |
申请日期 |
1995.12.29 |
申请人 |
OLIN CORPORATION |
发明人 |
DEEPAK MAHULIKAR;PAUL R. HOFFMAN |
分类号 |
H01L23/16;H01L23/31;H01L23/495 |
主分类号 |
H01L23/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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