| 摘要 |
PROBLEM TO BE SOLVED: To provide a photo setting resin composition capable of forming a hardening layer with high performance and superior properties such as heat resistivity, moisture resistivity, adhesive property, mechanical property and electrical property, and being suitable for manufacturing a printed circuit board, a high density multi-layer board and a semiconductor package, and provide a photosensitive element capable of forming a hardening layer with superior properties such as heat resitivity, moisture resistivity, adhesive property, mechanical property and electrical insulation property by stacking the layer of the photo setting resin composition onto a support. SOLUTION: The photo setting resin composition includes an epoxy resin (A) containing acid-denatured vinyl group, an elastomer (B), photopolymerization initiator (C), a diluent (D) and a hardener (E) as essential components. The hardened surface layer of the photo setting resin composition has elastic modules of 1-100 MPa in the temperature range of 200-220 deg.C using a dynamic viscoelasticity measuring method. The photo setting resin composition is employed for a permanent mask, and the photosensitive element is formed by stacking the photo setting resin composition onto the support. |
