IC CARD AND MANUFACTURE OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an IC card whose outward appearance is kept satisfactory by minimizing the influence of a built-in object to the outer surface and which is also stiff against various external forces. SOLUTION: This IC card is constructed by fusion bonding a base material 1 for a surface face side and a base material 2 for a rear face side which are made from a thermoplastic resin whose Vicat softening temperature is <=105 deg.C and thickness is >=200 μm and <=350 μm respectively and by an inlet sheet 3 which is made from a thermoplastic resin, where an electronic part 5 is mounted or embedded, and Vicat softening temperature of which is <=105 deg.C and which is >=30 μm in thickness.