| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit board capable of mounting a plurality of chip capacitors in a high connection strength in a high density in the board for mounting the plurality of chip capacitors. SOLUTION: The circuit board 101 comprises the plurality of chip capacitors 150 mounted on a board body 105. One terminal 153 of the one chip capacitor 150 and one terminal 153 of another chip capacitor 150 adjacent to the terminal 153 are connected via a solder 160 at a common pad 119s for the capacitor of the pad 119 formed at a lower surface 105c side of the body 105.</p> |
