发明名称 LAYERED ELECTRONIC COMPONENT
摘要 <p>PURPOSE: To provide a layered electronic component which has a high degree of freedom of design and which can realize high packing density, by creating such a construction as to restrain the generation of stray capacitance. CONSTITUTION: A layered electronic component 1 comprises a third layer 4 sandwiching and jointing a first layer 2 and a second layer 3. The first layer 2 and the second layer 3 comprise, respectively, dielectric substances with different dielectric constants. The third layer 4 comprises a dielectric substance or an insulator whose dielectric constant is lower than those of the dielectric substances comprising the first layer 2 and the second layer 3. And a plane wiring 15 and a plane wiring 16 are provided inside the third layer 4. A microwave wiring 8 inside the first layer 2 and a microwave wiring 12 inside the second layer 3 are connected through the plane wiring 15.</p>
申请公布号 JPH08195564(A) 申请公布日期 1996.07.30
申请号 JP19950004298 申请日期 1995.01.13
申请人 MURATA MFG CO LTD 发明人 MORIYASU AKIYOSHI;MORISHIMA YASUYUKI
分类号 H01L23/12;H01L23/538;H05K1/03;H05K1/16;H05K3/46;(IPC1-7):H05K3/46 主分类号 H01L23/12
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