| 摘要 |
PURPOSE: To provide a polyimide resin precursor of a specific composition with sufficient photosensitivity by adding acrylic acid and/or methacrylic acid to it and to flatten differences in the levels of wiring through interlayer isolation. CONSTITUTION: In the presence of solvent, 1.6 to 2 mols of monohydric alcohol with the number of carbon under 4 is added to 1mol of aromatic tetrabasic acid dianhydride and heated on a patterned substrate. Diester is used for all or part of the tetrabasic acid dianhydride, a photosensitive polymer composition, including a polyimide resin precursor 100 by weight and acrylic acid and/or methacrylic acid 1 to 400 by weight obtained by allowing 0.2 to 1mol of an amine compound and 0 to 0.8mol of a diamine compound, which are expressed by a formula (in the formula R<1> is an aromatic cyclic group, R<2> is a hydrocarbon group with the number of hydrogen or carbon under 3, and one R<2> may be different from another) to react with each other in the total quantity of 1mol of the amin compound and the diamine compound, is coated, dried, exposure-developed, and hardened. And an interlayer insulating film 51 and an upper wiring layer 7 are formed. This enables photosensitivity to be retained and differences in wiring levels to be eliminated. |
