PRODUCTION OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MOLD APPARATUS USED THEREIN

摘要

PURPOSE: To obtain a resin seal part free from air bubbles and a sink by discharging air, gas or the like from a mold cavity by opening the mold cavity to the atmosphere through a porous part or injecting a molding resin under pressure sufficiently lower than molding resin injection pressure. CONSTITUTION: A resin tablet 46 heated by a preheater is placed on a plunger 45 and a lead frame 42 is interposed between both mold main bodies 24, 34. A cylinder is driven to move a lower mold unit toward an upper mold unit 21 to allow the same to approach the unit 21 and a space containing a cavity 43 is formed. The tablet 46 brought to a molten state is pressed by the plunger 45 driven by the cylinder to allow a resin material to flow in the cavity 43 through a runner 47. Since the mold main bodies 24.34 are wholly constituted as air passing parts, the gas in the runner 47 and the cavity 43 is discharged to the outside through the mold main bodies.