| 摘要 |
An infrared ray image pickup device has a two-dimensional array structure having a sensor substrate, a plurality of scanning circuits provided to form two dimensional arrays on a surface of the substrate, a layer having a plurality of cavities provided over the scanning circuits, a plurality of beams provided to extend over the cavities, each of the beams including an element for converting a temperature variation to an electric signal, a supporting element provided on a peripheral region of the substrate for supporting a lens substrate including a plurality of micro-lenses that are located to face the beams so that a convex portion of each of the micro-lenses is spaced from a top of each of the beams by the same distance as a focal distance of the micro-lenses. The supporting element may have a plurality of convex portions made of boron phosphate silicate glass or boron silicate glass. Alternatively, the supporting element may include a plurality of bearings provided on a packaging substrate and bonding agents surrounding the bearings, the packaging substrate being provided thereon with the sensor substrate.
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