| 发明名称 |
RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT |
| 摘要 |
The resin composition comprises epoxy resin of cresol nobolak type, curing agent, curing accelerator, plasticizer, inorganic filler and 0.1-20wt.% high functional epoxy resin of formula(I) with respect to the total resin composition. In formula, R1 and R2 is alkyl and phenyl of C1-C10 or H2; n is 0 or 1-100.
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| 申请公布号 |
KR960010304(B1) |
申请公布日期 |
1996.07.30 |
| 申请号 |
KR19910003284 |
申请日期 |
1991.02.28 |
| 申请人 |
CHEIL IND. INC. |
发明人 |
KIM, HWAN - KUN;YU, JE - HONG;KIM, JIN - MO |
| 分类号 |
C08L63/04;(IPC1-7):C08L63/04 |
主分类号 |
C08L63/04 |
| 代理机构 |
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代理人 |
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| 地址 |
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