| 摘要 |
PURPOSE: To reduce failure rate by disposing a wire holding member for receiving a connect wire on the upper surface thereof between a die pad and each lead thereby suppressing short circuit between the connect wire and the edge of a semiconductor chip, short circuit between connect wires, etc. CONSTITUTION: In the semiconductor device, a semiconductor chip 5 is bonded onto a die pad 4 of a lead frame 1 and each electrode 6 of the semiconductor chip 5 is bonded through a connect wire 7 to a corresponding lead 2. More specifically, a wire holding member 10 for receiving the connect wire 7 on the upper surface thereof is interposed between the die pad 4 and each lead 2. The wire holding member 10 regulates flexure of the connect wire 7 to stabilize the profile thereof. With such arrangement, failure rate can be reduced by suppressing short circuit between the connect wire 7 and the edge of the semiconductor chip 5 or short circuit between the connect wires 7 and thereby the yield is increased in the manufacture. |
