| 摘要 |
PURPOSE: To increase the reliability of a connection with a socket or a probe in a product test by a method wherein external connecting terminals used for the performance test of a semiconductor device are installed at parts on a surface pattern in which resin is not formed or at parts on a rear-surface pattern in which external connecting terminals are not formed or at both of them. CONSTITUTION: Circuit patterns which are formed on the surface and the rear surface of a circuit board 108 are connected by through holes 111, an IC chip 103 is mounted on a surface pattern 102 so as to be molded by a sealing resin 104, and metal balls 106 as external connecting terminals are formed on a rear surface pattern 105. Then, external connecting terminals 101 used for the performance test of a semiconductor device are installed at parts on the surface pattern 102 in which resin is not formed or at parts on the rear surface pattern 105 in which the metal balls 106 are not formed or at both of them. Thereby, the reliability of a connection with a socket or a probe used to make the test of a product can be enhanced. |
