| 摘要 |
PURPOSE: To provide an aluminum nitride multilayer wiring board and its manufacturing method where wiring metal is made minute without mixing substrate constituents with the wiring metal and at the same time the joint between the aluminum nitride and wiring metal is stabilized and the generation of the continuity failure and appearance failure of a wiring metal layer is prevented. CONSTITUTION: In an aluminum nitride multilayer wiring board where a plurality of aluminum nitride boards forming a wiring layer are laminated, at least one aluminum nitride board contains an inorganic compound or a metal for making fine the wiring layer by reacting with the metal for constituting the wiring layer. Also, the content of the inorganic compound or metal contained in the aluminum nitride board ranges from 0.02 to 2.0mol.%. |
