| 摘要 |
PURPOSE: To provide a method for forming patterns using a photosensitive resin compsn., which method is adequately adoptable to a two-layer resist process method and is capable of forming patterns having high O2 -RIE resistance. CONSTITUTION: The photosensitive resin compsn. having a poly(alkoxysiloxane) which is a poly(siloxane) deriv. having an alkoxy group and an acid generating agent to generate an acid by exposure is applied on a ground surface 1 to be formed with patterns to form a resin compsn. layer 2. In succession, this resin compsn. layer is successively subjected to a first exposure treatment, first heat treatment and treatment by a hydrofluoric acid and is further subjected to a second heat treatment or second exposure treatment and second heat treatment. |
