发明名称 |
Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging |
摘要 |
An improved semiconductor unit package is disclosed. This package is implemented by a semiconductor device having an electrode pad, a substrate having a terminal electrode, a bump electrode formed on the electrode pad, a conductive adhesion layer with flexibility, and an encapsulating layer formed by curing a composition the viscosity and thixotropy index of which are below 100 Pa.s and below 1.1, respectively. Such a composition essentially consists of (A) a resin binder that contains, for example, a polyepoxide, an acid anhydride, and a rheology modifier and (B) a filler. The rheology modifier is one capable of impeding interaction between a free acid contained in the acid anhydride and a polar group at the surface of the filler. An encapsulant with improved flowability is used, so that the encapsulant readily flows and spreads to fill a gap between the semiconductor device and the substrate with no air bubbles. This achieves semiconductor unit packages with high reliability and productivity. <IMAGE> |
申请公布号 |
EP0724289(A2) |
申请公布日期 |
1996.07.31 |
申请号 |
EP19960101286 |
申请日期 |
1996.01.30 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
OMOYA, KAZUNORI;OOBAYASHI, TAKASHI;SAKURAI, WATARU;HARADA, MITSURU;BESSHO, YOSHIHIRO |
分类号 |
H01L21/56;H01L21/60;H01L23/29;H01L23/485 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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