发明名称 RESIN COMPOSITION FOR PLATING
摘要 PURPOSE: To improve the thermal shock resistance, adhesive strength, and impact strength of a plating film by compounding a specific copolymer, a graft copolymer, and an organosilicon compd. CONSTITUTION: A graft copolymer is obtd. by the emulsion polymn. of 95-30 pts.wt. monomer mixture comprising 60-90wt.% arom. vinyl monomer, 10-40wt.% vinyl cyanide monomer, and 0-30wt.% other monovinyl monomer in the presence of 5-70 pts.wt. polydisperse rubber latex contg. 5-30wt.% rubber having an average particle size of 0.35-0.50μm, 70-95wt.% rubber having an average particle size of 0.2-0.32μm, and 0-15wt.% rubber having an average particle size of 0.2μm or lower. 100 pts.wt. compsn. comprising 10-90 pts.wt. graft copolymer obtd. as above and 90-10 pts.wt. copolymer formed from a monomer mixture comprising 60-90wt.% arom. vinyl monomer. 10-40wt.% vinyl cyanide monomer, and 0-30wt.% other vinyl monomer is compounded with 0.01-0.5 pt.wt. organosilicon compd. of the formula (wherein R1 and R2 are each H, alkyl, etc.; and n is 1 or higher) having a viscosity of 50, 000-100, 000cSt at 25 deg.C.
申请公布号 JPH08193162(A) 申请公布日期 1996.07.30
申请号 JP19950019917 申请日期 1995.01.13
申请人 MITSUBISHI RAYON CO LTD 发明人 SAKAI HIROSHI;SHIRATORI TAKAAKI;SHIGEMITSU HIDEYUKI
分类号 C08L25/10;C08L55/00;C08L55/02;C23C18/16;C25D5/56;(IPC1-7):C08L55/02 主分类号 C08L25/10
代理机构 代理人
主权项
地址