| 摘要 |
PURPOSE: To mount a plurality of power semiconductor elements capable of development in series by arranging the plurality of power semiconductor elements and copper foils for wiring in asymmetry, and coupling these with one another by coupling elements in specified arrangement. CONSTITUTION: A unit is made by arranging a plurality of power semiconductor elements, for example, an insulated gate type transistor chip 401, a diode chip 301, and copper foils 408-410 for wiring in asymmetry on an aluminum nitride substrate. A plurality, that is, these three units are arranged in the same direction on a metallic board for heat radiation. Moreover, electrode terminal feet 306-308 and 323-325 for electrically connecting these units are arranged at the same intervals on each unit. And, these electrode terminal feet 306-308 and 323-325 are coupled with one another by coupling terminal feet 312, 315, 329, and 332. Hereby, power semiconductor elements such as an insulated gate type transistor, a diode, etc., capable of development in series can be mounted. |
