| 摘要 |
<p>PURPOSE: To obtain a wafer boat which is capable of lessening a wafer in crystal defect even if the wafer is large in diameter and reducing generated particles to an irreducible minimum by a method wherein the wafer boat is so structured as to support the wafers by the rear side, the peripheral part, and the plane part surrounded with the peripheral part respectively. CONSTITUTION: Si wafers as works are stacked up in layers and held by a wafer boat providing a small gap between them in a pressure-reduced atmosphere of high temperatures in a semiconductor manufacturing equipment such as a vacuum CVD device or an oxidation diffusion device. Each of the wafers is held by the board by the rear side, peripheral part, and plane part surrounded with the peripheral part. For instance, supports 1 and crossbars 4 as wide as the diameter of the support 1 are provided between an upper and a lower base plate, 3 and 3, and furthermore longitudinal bars 5 are also provided between the crossbars 4, and projections 6 are formed on the upsides of the bars 4 and 5. A wafer supporting projection 1b is provided in a groove cut in the support 1.</p> |
