发明名称 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
摘要 PURPOSE: To achieve contact and contact bonding to an opposing conductor circuit layer by allowing a protrusion to break through an insulator resin layer with the pressure obtained by pressing a lamination body using a press tool plate. CONSTITUTION: A protrusion 112 for connecting first and second conductor layers, a protrusion 122 for connecting second and third conductor layers, and a protrusion 132 for connecting third and fourth conductor layers break through an insulator 120 between the first and second conductor layers, an insulator 130 between the second and third conductor layers, and an insulator 140 between the third and fourth conductor layers, thus achieving contact to a second conductor layer 121, a third conductor layer 131, and a fourth conductor layer 141, respectively, for improved contact bonding. The insulator layer between conductor layers is a sheet made of insulation resin and the protrusion for connecting conductor layers is formed by electrolytic plating.
申请公布号 JPH08195560(A) 申请公布日期 1996.07.30
申请号 JP19950003495 申请日期 1995.01.12
申请人 OKI PURINTETSUDO CIRCUIT KK;OKI ELECTRIC IND CO LTD 发明人 ITAYA SATORU;KARASUNO YUTAKA;OZAWA SUSUMU
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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