发明名称 MOLD APPARATUS FOR MOLDING RESIN
摘要 PURPOSE: To provide a mold apparatus good in filling balance and capable of molding a fine lattice shape part good in appearance quality and uniform in aperture rate. CONSTITUTION: Flow leaders 11, 12, 13 for improving resin filling properties are provided so as to extend over the recessed parts 4 of a core 3 for molding a fine lattice shape part. The recessed parts 4 are formed so that the width of each of the recessed parts 4 is adjusted between the inside width and outside width between the recessed parts 4. By this constitution, places where the widths of the flow leaders 11, 12, 13 looked from the surface side of a molded product are adjusted are concealed by the fine lattice shape part and aperture parts closed halfway are eliminated.
申请公布号 JPH08192445(A) 申请公布日期 1996.07.30
申请号 JP19950005388 申请日期 1995.01.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MORIMOTO TAKASHI;YAIRO TAKASHI;NAKANISHI TSUTOMU
分类号 B29C33/76;B29C33/42;B29C45/26;B29C45/32;B29C45/37;B29L28/00;H04R1/02;(IPC1-7):B29C45/26 主分类号 B29C33/76
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