| 摘要 |
PURPOSE: To enhance heat dissipation efficiency and the thermal reliability of a resin sealed semiconductor device. CONSTITUTION: The resin sealed semiconductor device comprises a tab suspension lead, a tab 2C integrated with the tab suspension lead, a semiconductor pellet 1 mounted on the pellet mounting face of the tab 2C, and an inner lead 2A connected electrically with the outer terminal of the semiconductor pellet 1, all of which are sealed with a resin sealing body 4. Thickness t1 of the tab 2C is set thicker than the thickness t2 of the inner lead 2A and the rear surface of the tab 2C, facing the pellet mounting face, is exposed from the surface of the resin sealing body 4. The lead frame comprises the inner lead 2A integrated with a frame body, the tab 2C, and the tab suspension lead, wherein the thickness t1 of the tab 2C is set thicker than the thickness t2 of the inner lead 2A. |
