| 摘要 |
In an apparatus for removing protective films, a groove is formed in a roller having an adhesive surface sufficient to peel off a protective film from a printed wiring board. The exposed printed wiring board, on which a dry film provided with a protective film is applied, is passed between the rollers. Thus, the protective film is peeled off from the surface of the dry film resist of the printed wiring board and adhered to the roller so as to be removed. As a result, the protective film can be removed at a high speed, and automated removal of protective films can be achieved.
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