| 摘要 |
PURPOSE: To dispense with various kinds of packages and lead frames by mounting a semiconductor device or electronic components having specified intermediate leads, on a mounting substrate, and mounting other semiconductor devices or electronic components on the semiconductor device or the electronic components mounted on the substrate. CONSTITUTION: This device is provided with an intermediate lead 7 where one end is electrically connected with a lead and the other end is exposed on the surface of a sealing body. Semiconductor devices 21 and 23 or electronic components 22 and 24 having these relays are mounted on a mounting substrate 1. And, other semiconductor devices 31 and 32 or electronic components 33 are mounted on the semiconductor devices 21 and 23 or the electronic components 22 and 24 mounted on the board 1. Furthermore, the semiconductor device 13 or the electronic components 33 is given heat conductive members 9 and 16, which absorbs and radiates the heat of the semiconductor device whose heat radiation is not performed enough, being surrounded by other semiconductor devices 11, 12, 21, 23, 31 and 32, the electronic components 22 and 24, or the substrate 1. The density of mounting of electronic components can be improved, by mounting such devices, etc., in multilayers.
|
