Soldering process

摘要

A soldering process using two different types of solder alloys is disclosed. The first solder alloy (115) undergoes a solid-to-liquid transition at a first temperature. The second solder alloy (120) undergoes this solid-to-liquid transition at a second temperature, the second temperature being greater than the first temperature. The soldering composition is deposited (20) on a substrate (100) having solderable portions (105) and is heated to a temperature that is above the first temperature but below the second temperature (32). During this time, the first solder alloy liquifies, while the second solder alloy remains solid. The soldering composition is subsequently cooled (40) to solidify the first solder material. A part or electronic component is added (80) to the solidified solder material and the solder materials is again heated above the second temperature (30) in order to reflow the solder and form a metallurgical bond between the substrate and the electronic component.