发明名称 ADHESIVE FILM FOR SEALING OPENINGS IN THERMOPLASTIC SUBSTRATES
摘要 <p>The present invention provides an adhesive film and method for sealing openings in a rigid thermoplastic substrate such as a vehicle instrument panel retainer. The adhesive film includes an adhesive layer, which is adherable to the thermoplastic substrate, and a thermoformable base layer. In a preferred embodiment, the adhesive film is heat sealed around the openings of the substrate by a vacuum thermoforming process to prevent polymer foam from leaking through the openings during manufacture of the instrument panel.</p>
申请公布号 WO1996022340(P1) 申请公布日期 1996.07.25
申请号 US1996001071 申请日期 1996.01.16
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