摘要 |
<p>An electronic circuit structure having a reduced size includes a circuit substrate, an aperture extending through the circuit substrate, and an electronic component suspended with the aperture. The suspension of electronic component within the aperture significantly reduces the profile of the overall electronic circuit structure. The aperture further enables eletronic components to be mounted in a partially overlapping fashion to reduce the surface area of the electronic circuit structure. The electronic circuit structure can make use of standard FR-4, GR-10, or ceramic circuit substrates or multilayer flex circuits, as well as electronic components in the form of standard leaded integrated circuit packages. The mounting of the electronic component within the aperture of the circuit substrate provides an advantage of assisting in heat dissipation. The incorporation of mesh-like voltage and ground planes can further aid in heat dissipation and provide electrical isolation and capacitive filtering. In addition, the electronic circuit structure faciliates high density packaging of several electonic structures, for example, in a stacked or radial configuration.</p> |