发明名称 Integrated battery pack with lead frame connection
摘要 An integrated battery package, that contains semiconductor chips, for example to control and regulate battery charging and to monitor the package operation, uses a single lead frame to interconnect several internal chips, to internally connect said control chips to the battery and to connect the whole package assembly externally. The invention eliminates the need for any additional connecting mechanism. The invention uses established production processes. A molding process, similar to plastic chip encapsulation, encloses the battery controlling chips and forms at the same time the body of the battery package. An additional cover, sealed to said body, closes the battery package. <IMAGE>
申请公布号 EP1544917(A1) 申请公布日期 2005.06.22
申请号 EP20030392012 申请日期 2003.12.15
申请人 DIALOG SEMICONDUCTOR GMBH 发明人 MALCOLM, EDWARDS
分类号 H01L23/58;(IPC1-7):H01L23/495 主分类号 H01L23/58
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