| 摘要 |
<p>A photodiode array comprises a semiconductor substrate including a plurality of pn junction type photodiodes arranged in an array form on the light incidence surface side and a surface opposite the incidence surface is formed of a (100) plane, through-holes that are formed in regions sandwiched between the photodiodes and penetrate the semiconductor substrate from the incidence surface side to the opposite surface side, and conductor layers continued from the incidence surface to the opposite surface through the wall faces of the through-holes, wherein the through-holes are formed by connecting perpendicular hole portions formed almost perpendicular to the incidence surface on the incidence surface side and quadrangular pyramidal shaped hole portions formed on the opposite surface side inside the semiconductor substrate, and the wall face of the quadrangular pyramidal shaped hole portion is formed of a (111) plane. <IMAGE></p> |
